Products and Solutions

PV Cell Manufacturing Automation Equipment

HJT Cell Plating Metallization Equipment

Features introduction

Pulse type&continuous type deposition mode;
Ultra-close cathode and anode distance, High current density;
Fixtureless, horizontal in-line process;
Laddering current density regulation

Technical performance

  • Transfer ways: 5;
  • Wafer size: 210*210mm
  • Capacity: ≥3600pcs/h;
  • Uptime: ≥95%;
  • Product yield>99.9%.

 

Parameter

Layout dimension: 35960mm* 2500mm*2500mm

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